Ceramic Insulating Heat Dissipation Substrates (White Tile, Plain Substrates)
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Contact UsSilicon nitride ceramics:
White tile (plain substrates)
Toshiba Materials' silicon nitride ceramic substrates are among the best in the world for heat dissipation and strength.
They are used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight.
Their extremely high strength also makes them a key material that increases the life and reliability of the products they are used in.
Features
- Among the best in the world for heat dissipation and strength
- Enables designs involving drilling and screwing or pressure welding, methods that are usually difficult
Comparison with other materials
| Material | Alumina | Alusil | AlN | Si3N4(SIN) | |
|---|---|---|---|---|---|
| Al2O3 | (ZDA,ZTA) | [TAN-170-250] | For electronic applications | For structural applications | |
| [TSN-90] | [TSN-03] | ||||
| Thermal conductivity (W/(m K)) |
20-30 | 24 | 160-255 | 85-95 | 20 |
| Bending strength (MPa) |
310-400 | 500-600 | 300-450 | 650 | 1000 |
| Fracture toughness (MPa-m1/2) |
3-4 | 5-7 | 2-4 | 5-7 | 6-8 |
| Linear expansion coefficient (x10-6/K) |
7.1-8.1 | 7-8 | 4.5-4.6 | 2.6 | 3.0 |
| Dielectric strength (kV/mm) |
>12 | >14 | >14 | >14 | >14 |
| Relative permittivity | 9-10 | 12 | 8-9 | 7-9 | 7-9 |
Product specifications (Standard design)
| Item | Unit | Aluminum nitride (AlN) | Silicon nitride (SiN) | ||
|---|---|---|---|---|---|
| TAN-170 | TAN-200 | TAN-230 | TSN-90 | ||
| External dimensions | mm | Max. 160×160 φ210 | Max. 160×160 | Max. 100×100 | Max. 170×130 |
| Tolerance | Standard: ± 0.2mm (laser cut) | ± 0.15mm (laser cut) | |||
| Thickness | mm | 0.4-2.5 | 0.4-1.5 | 0.635 | 0.32/0.635 |
| Tolerance | Standard: ± 10% ±0 .02mm (polished) | ±0.05mm | |||
| Warping | mm | 0.4% or less | 0.4% or less (≤50mm) | ||
| Surface processing | - | Standard: Blasted, lapped, mirror polished, no surface processing | Blasted | ||
*The value of a table is not a guaranteed performance.
Examples of uses
- Double-sided heat dissipation in power cards (power semiconductors) - power control units for automobiles
- Power IGBT/MOSFET discrete packaging
- Inverters
- Converters
- Batteries
- Secondary cells
- Automobile air conditioning
- LEDs
Benefits for customers
- Higher output
- Smaller size
- Lighter weight
- Longer life
- Greater reliability
Catalog download
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