Ceramic Insulating Heat Dissipation Substrates (Plain Substrates)

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Silicon nitride ceramics:
Plain substrates

Toshiba Materials' silicon nitride ceramic substrates have both heat dissipation and strength.
They are used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight.
Their extremely high strength also makes them a key material that increases the life and reliability of the products they are used in.

Silicon Nitride Ceramics: Plain substrates

Features

  • Among the best in the world for heat dissipation and strength
  • Enables designs involving drilling and screwing or pressure welding, methods that are usually difficult

Comparison with other materials

For electronic silicon nitride (SIN), instead of lowering the bending strength from our structural silicon nitride TSN-03, the thermal conductivity has been significantly improved to achieve both thermal conductivity and bending strength.
Comparison with other materials : Silicon nitride ceramics
Item Measuring method Si3N4(SIN) AlN
For electronic applications For structural applications [TAN-170-250]
[TSN-90] [TSN-03]
Thermal conductivity
(W/(m K))
JIS_R1611 Laser flash method 85-95 20 160-255
Bending strength
(MPa)
JIS_C2141 7_Three point bending strength 650 1000 300-450
Fracture toughness
(MPa-m1/2)
JIS_R1607 IF(Indentation Fracture) method 5-7 6-8 2-4
Linear expansion coefficient
(x10-6/K)
JIS_C2141 10 Thermomechanical Analysis 2.6 3.0 4.5-4.6
Dielectric strength
(kV/mm)
JIS_C2110-1 5.2.1.2 >14 >14 >14
Relative permittivity JIS_C2141 16. 7-9 7-9 8-9

Product specifications (Standard design)

Product specifications : Silicon nitride ceramics
Item Unit Silicon nitride (SiN)
TSN-90
External dimensions mm Max. 170×130
Tolerance ± 0.15mm (laser cut)
Thickness mm 0.32/0.635
Tolerance ±0.05mm
Warping mm 0.4% or less (≤50mm Span)
Surface processing - Blasted

*The value of a table is not a guaranteed performance.

*Please contact us if you have any requests regarding external dimensions and thickness.

Examples of uses

  • Double-sided heat dissipation in power cards (power semiconductors) - power control units for automobiles
    Double-sided heat dissipation in power cards (power semiconductors) - power control units for automobiles
  • Power IGBT/MOSFET discrete packaging
    Power IGBT/MOSFET discrete packaging
  • Inverters
  • Converters
  • Batteries
  • Secondary cells
  • Automobile air conditioning
  • LEDs

Benefits for customers

  • Higher output
  • Smaller size
  • Lighter weight
  • Longer life
  • Greater reliability

If you have any inquiries, please contact us.

Open 9:00am-5:00pm (business days)

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Related product

  • Aluminum nitride ceramics: Plain substrates
  • Silicon Nitride Ceramics: Insulating Circuit Substrates
  • Aluminum nitride ceramics: Thin metallized film substrates
  • Silicon Nitride Ceramics for Machine Parts
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