Ceramic Insulating Heat Dissipation Substrates (Plain Substrates)
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Contact UsSilicon nitride ceramics:
Plain substrates
Toshiba Materials' silicon nitride ceramic substrates have both heat dissipation and strength.
They are used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight.
Their extremely high strength also makes them a key material that increases the life and reliability of the products they are used in.
Features
- Among the best in the world for heat dissipation and strength
- Enables designs involving drilling and screwing or pressure welding, methods that are usually difficult
Typical values for properties
| Items | Measuring method |
Unit | Silicon nitrides(Si3N4) | ||
|---|---|---|---|---|---|
| TSN-90 | |||||
| Density | JIS Z8807 | RT | g/cm3 | 3.35 | |
| Specific heat | JIS C2141 | J/kg･K | 650 | ||
| Thermal conductivity | JIS R1611 | W/m･K | 90 | ||
| Coefficient of thermal expansion |
JIS C2141 | RT～500℃ | x10-6/K | 3.4 | |
| Dielectric strength | JIS C2110-1 | 50Hz | kV/mm | 25.0 | |
| Volume resistivity | JIS C2141 | RT | Ω･m | 1x1015 | |
| Dielectric constant | JIS C2141 | 1MHz | 8.0 | ||
| Dielectric factor | JIS C2141 | 1MHz | tanδx10-4 | 8.0 | |
| Three point bending strength |
JIS C2141 | RT | MPa | 680 | |
| Fracture toughness | JIS R1607 | RT | MPa･m1/2 | 6.5 | |
| Young's modulus | JIS R1602 | RT | GPa | 300 | |
| Poisson's ratio | JIS R1602 | 0.27 | |||
| Features | High thermal conductivity High strength |
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| Recommendatory applications | Substrates for semiconductor assembly Radiator plates(for compression force) Heat sinks |
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The values in the table are reference values,not guaranteed values.
Product specifications (Standard design)
| Item | Unit | Silicon nitride (SiN) |
|---|---|---|
| TSN-90 | ||
| External dimensions | mm | Max. 170×130 |
| Tolerance | ± 0.15mm (laser cut) | |
| Thickness | mm | 0.32 |
| Tolerance | ±0.05mm | |
| Warping | mm | 0.4% or less (≤50mm Span) |
| Surface processing | - | Blasted |
*The value of a table is not a guaranteed performance.
*Please contact us if you have any requests regarding external dimensions and thickness.
Examples of uses
- Double-sided heat dissipation in power cards (power semiconductors) - power control units for automobiles
- Power IGBT/MOSFET discrete packaging
- Inverters
- Converters
- Batteries
- Secondary cells
- Automobile air conditioning
- LEDs
Benefits for customers
- Higher output
- Smaller size
- Lighter weight
- Longer life
- Greater reliability
Catalog
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