Ceramic Insulating Heat Dissipation Substrates (Pattern Circuit Substrates)

If you have any inquiries, please contact us.

Tokyo+81-3-3457-4874

Open 9:00am-5:00pm (business days)

Silicon Nitride Ceramics: Insulating Circuit Substrates

These insulating heat dissipation substrates combine a copper circuit with silicon nitride, one of the world's best ceramic materials for heat dissipation and strength.
The body of the substrate is made from strong ceramic material and the copper circuit can be between 0.1mm and 0.8mm thick.
Silicon nitride's heat dissipation property makes it a key material for making more compact power modules with higher output. It also has an outstanding heat resistance cycle, resulting in a long life and high reliability in substrates.
This makes it well suited to a wide range of structures in power modules, such as ultrasonic joining of copper electrode terminals, elimination of copper bases and drilled holes for screws.

Features

Among the best in the world for heat dissipation and strength
Enables use of thick copper circuits
Outstanding heat resistance cycle

Product Specifications

Standard Design

Standard Design : Silicon Nitride Ceramics
A, B	Ceramic exterior	Maximum effective range 90×110
A, B	Tolerance	±0.15
C	Ceramic thickness	0.25 / 0.32 / 0.635
C	Tolerance	±0.05
Electrode material		Cu
D	Copper thickness	0.1 - 0.4	0.5 - 0.6	0.7 - 0.8
E	Creepage distance	≥0.5	≥0.7	≥1.0
F	Pattern dimensions	≥0.5	≥0.7	≥1.0
G	Dimensions between patterns	≥0.4	≥1.0	≥1.2
H	Taper dimensions	≥0.5D (Maximum 1/2 of the thickness of the copper)

*The value of a table is not a guaranteed performance.

Joining method of copper circuit

In our AMC (active metal brazed copper) substrates, the copper circuit is joined to the ceramic material with a brazing material in between.
This makes it easy to create fine patterns, and produces power module substrates with outstanding heat resistance and cost effectiveness.

* Contact us for details on aluminum nitride insulating circuit substrates