Ceramic Insulating Heat Dissipation Substrates (Pattern Circuit Substrates)

If you have any inquiries, please contact us.

Open 9:00am-5:00pm (business days)

Contact Us

Silicon Nitride Ceramics: Insulating Circuit Substrates

These insulating heat dissipation substrates combine a copper circuit with silicon nitride, one of the world's best ceramic materials for heat dissipation and strength.
The body of the substrate is made from strong ceramic material and the copper circuit can be between 0.1mm and 0.8mm thick.
Silicon nitride's heat dissipation property makes it a key material for making more compact power modules with higher output. It also has an outstanding heat resistance cycle, resulting in a long life and high reliability in substrates.
This makes it well suited to a wide range of structures in power modules, such as ultrasonic joining of copper electrode terminals, elimination of copper bases and drilled holes for screws.

Silicon Nitride Ceramics: Insulating Circuit Substrates

Features

  • Among the best in the world for heat dissipation and strength
  • Enables use of thick copper circuits
  • Outstanding heat resistance cycle

Product Specifications

Standard Design

Standard Design : Silicon Nitride Ceramics
A, B Ceramic exterior Maximum effective range 90×110
Tolerance ±0.15
C Ceramic thickness 0.25 / 0.32 / 0.635
Tolerance ±0.05
Electrode material Cu
D Copper thickness 0.1 - 0.4 0.5 - 0.6 0.7 - 0.8
E Creepage distance ≥0.5 ≥0.7 ≥1.0
F Pattern dimensions ≥0.5 ≥0.7 ≥1.0
G Dimensions between patterns ≥0.4 ≥1.0 ≥1.2
H Taper dimensions ≥0.5D (Maximum 1/2 of the thickness of the copper)

*The value of a table is not a guaranteed performance.

Joining method of copper circuit

In our AMC (active metal copper circuit) substrates, the copper circuit is joined to the ceramic material with a brazing material in between.
This makes it easy to create fine patterns, and produces power module substrates with outstanding heat resistance and cost effectiveness.

* Contact us for details on aluminum nitride insulating circuit substrates

Examples of uses

  • Power modules (inverters/converters)

Product introduction video

     

Benefits for customers

  • Higher output
  • Smaller size
  • Low loss
  • Long life/greater reliability

Aluminum nitride ceramics: Thin metallized film substrates

Our aluminum nitride ceramic substrates with thin metallized film are among the world's best for heat dissipation. Our range includes thin titanium, platinum and gold film, gold tin soldering of patterns and sub-mounting with gold bumps. These substrates are used in a wide range of fields from laser diodes to LEDs for general lighting, high-power LEDs for headlights and deep UV LEDs that are currently in demand for purposes such as sterilization lamps and resin hardening lamps due to their high heat dissipation.

Aluminum Nitride Ceramics: Thin Metallized Film Substrates
Substrates with gold tin soldering Substrates with gold soldering Copper plated substrates

Features

  • Extensive range with among the best heat dissipation in the world
  • Via holes can be created (currently under development)
  • Copper patterns can be created in the plating (currently under development)

Product Specifications

Standard Design

Standard Design : Aluminum nitride ceramics
Item Unit Aluminum nitride (AlN)
TAN-170 TAN-200 TAN-230 TAN-250
Aluminum nitride (AlN) material Thermal conductivity W/m・K 160 190 220 240
Thickness mm 0.20-0.35
Thickness difference mm ±0.02
Thin conductor film Film structure - Ti / Pt / Au
Film thickness μm 0.5-3.5 (with pattern)
Precision of film thickness % ±20
Solder film Film structure - Au-Sn (Au:66-76wt%)
Film thickness μm 1.5-3.5 (with pattern), 1.5-5.0 (without pattern)
Precision of film thickness % ±20
Pattern formation Patterning precision μm ±20
Cutting Cutting precision μm ±30
Delivery format   Sheet adhesion

*The value of a table is not a guaranteed performance.

Examples of uses

  • Deep UV LED lamps (for resin hardening and sterilization)
  • High-power LEDs (headlights) and general LEDs
  • Laser cinema equipment
  • Laser processing equipment
  • Various sensor parts
  • Optical pickup (reading and writing of DVDs and CDs)

Benefits for customers

  • Higher output
  • Smaller size

If you have any inquiries, please contact us.

Open 9:00am-5:00pm (business days)

Contact Us

Related product

  • Ceramic Insulating Heat Dissipation Substrates (White Tile, Plain Substrates)
  • Bearings, Balls and Other Machinery Parts

Find other products

Fine Ceramics

Scintillators

Magnetic Parts

Tungsten
/Molybdenum

Semiconductor Production Materials and Various Coatings

Other Metals and Parts

Open in new tab
: The link of this icon opens in a new browser window.
To the top of this page