Ceramic Insulating Heat Dissipation Substrates (White Tile, Plain Substrates)
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Contact UsAluminum nitride ceramics:
White tile (plain substrates)
Our aluminum nitride ceramic substrates are among the world's best for heat dissipation. Our insulating heat dissipation substrates have thermal conductivities ranging from 160 to a maximum of 255W/(m K), making them ideal for areas requiring high heat dissipation or those requiring a somewhat thick substrate that can withstand high voltages.
They are also ideal for use as semiconductor substrates as they have a similar thermal expansion rate to silicon, silicon carbide, gallium nitride and gallium arsenide chips.
Features
- Extensive range with among the best heat dissipation in the world
- We also have a range of substrates with thin metallized film.Link
Comparison with other materials
| Material | Alumina | Alusil | AlN | Si3N4 (SIN) | |
|---|---|---|---|---|---|
| Al2O3 | (ZDA,ZTA) | [TAN-170-250] | For electronic applications | For structural applications | |
| [TSN-90] | [TSN-03] | ||||
| Thermal conductivity (W/m・K) |
20-30 | 24 | 160-255 | 85-95 | 20 |
| Bending strength (MPa) |
310-400 | 500-600 | 300-450 | 650 | 1000 |
| Fracture toughness (MPa・m1/2) |
3-4 | 5-7 | 2-4 | 5-7 | 6-8 |
| Linear expansion coefficient (×10-6/K) |
7.1-8.1 | 7-8 | 4.5-4.6 | 2.6 | 3.0 |
| Dielectric strength (kV/mm) |
>12 | >14 | >14 | >14 | >14 |
| Relative permittivity | 9-10 | 12 | 8-9 | 7-9 | 7-9 |
Product specifications (Standard design)
| Item | Unit | Aluminum nitride (AlN) | Silicon nitride (SiN) | ||
|---|---|---|---|---|---|
| TAN-170 | TAN-200 | TAN-230 | TSN-90 | ||
| External dimensions | mm | Max. 160×160 φ210 | Max. 160×160 | Max. 100×100 | Max. 170×130 |
| Tolerance | Standard: ± 0.2mm (laser cut) | ± 0.15mm (laser cut) | |||
| Thickness | mm | 0.4-2.5 | 0.4-1.5 | 0.635 | 0.32/0.635 |
| Tolerance | Standard: ± 10% ±0 .02mm (polished) | ±0.05mm | |||
| Warping | mm | 0.4% or less | 0.4% or less (≤50mm) | ||
| Surface processing | - | Standard: Blasted, lapped, mirror polished, no surface processing | Blasted | ||
*The value of a table is not a guaranteed performance.
Examples of uses
- Bases of thick film, thin film and microcircuit substrates
- Resistance chips (chip resistors)
Benefits for customers
- Higher output
- Smaller size
Catalog download
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