For semiconductor device manufacturing
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Titanium sputtering target
We offer high-purity titanium sputtering targets that produce the minimum possible particles from the beginning to the end of their serviceable life, which was realized by making the metal have a fine, homogenized microstructure and optimized surface conditions.
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Impurities contents
(unit: ppm)
| Grade |
Fe |
Ni |
Cr |
Na |
K |
O |
| 5N UP |
<9 |
<5 |
<5 |
<0.03 |
<0.05 |
<200 |
| 4N5 UP |
<20 |
<20 |
<20 |
<0.1 |
<0.1 |
<200 |
| 4N UP |
<50 |
<20 |
<10 |
<0.1 |
<0.1 |
<650 |
| 3N5 UP |
<200 |
<20 |
<10 |
<0.1 |
<0.1 |
<1000 |
FAQ
FAQ on sputtering targets
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