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Product Information
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Sealing materials
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Outline
These materials are used as sealing metals for CRTs, various electron tubes, lead-in seals for lighting equipment, semiconductor packages and other sealed glass or ceramic components.
The point is to select the best-fit material that has the most similar thermal expansion coefficient to the objective glass.
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Products
| Type |
Composition
(w t%) |
Thermal expansion
coefficient
(×10-7/°C) |
Features |
Applications |
KOV
(Kovar) |
Ni 29
Co 17
Fe Bal. |
30–400°C
30–500°C |
48
60 |
This material has a thermal expansion coefficient similar to that of soft glass, shows good contact with glass and has good machinability. |
For ceramics,
hard glass
and semiconductors |
NSI
(42 Alloy) |
Ni 40.5
Fe Bal. |
30–330°C |
50 |
For lead frames of IC packages |
| PCV-K |
Cr 18
Ti 0.4
Fe Bal. |
30–500°C |
115 |
This material has a thermal expansion coefficient similar to that of soft glass, shows good contact with glass and produces electric-conductive oxides. |
For stud pins of color CRTs |
GNC
(476 alloy) |
Ni 47
Cr 6
Fe Bal. |
30–400°C |
102 |
This material has a thermal expansion coefficient similar to that of soft glass, shows good contact with glass and has good machinability. |
For soft glass
Anode buttons for color CRTs |
TNF
(50 alloy) |
Ni 50
Fe Bal. |
30–400°C |
99 |
For soft glass
For semiconductors |
| NSL |
Ni 42
Special ingredient
Fe Bal. |
30–330°C |
50 |
Strengthened 42 alloy |
Substitutes Kovar |
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