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Aluminum nitride (AlN) metallized substrates

Aluminum nitride (AlN) metallized substrates

Outline

AlN metallized substrates are made by plating nickel or gold AlN substrates after they have been burned at high temperature with special tungsten paste on their surface. They are highly reliable because of the strong joint of the circuit material and the AlN substrates, which was made by the co-fire process. AlN metallized substrates are also suitable for making multi-layered substrates that have through holes.

Advantages

  • Suitable for making high-density, multi-layered circuit wiring
  • Suitable for making micro-fine circuit wiring by screen printing
  • Adhesion of the circuit conductor to the substrates is highly reliable because of the co-fire process.

Conceptual scheme of multi-layered substrates

FAQ

FAQ on Aluminum nitride fine ceramics

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