Fine Ceramics

Outline

Heat dissipation Fine Ceramics came to be an essential material for electronics devices that meet the needs of high output, large-scale integration, thin and light body, higher frequency and environment friendliness.

We offer the world's highest heat-conductive aluminum nitride (AlN) substrates that we manufacture with our core technology: grain boundary control of ceramic microstructure.

Advantages

• High heat conductivity
• High insulation and high withstanding voltage
• Low thermal expansion coefficient similar to those of Si, GaN and GaAs semiconductors
• Substitutes high heat-conductive but toxic berylia (BeO) substrates.

Applications

• Power module substrates for automobiles or power semiconductors
• Substrates for high-frequency circuits
• AlN package for light-emitting diode (LED)
• Sub-mounting substrates for optical pickup devices for both DVDs and CDs
• Heat dissipation substrates

FAQ

FAQ on aluminum nitride Fine Ceramics

Outline

Toshiba Materials offers silicon nitride (Si₃N₄) Fine Ceramics that have excellent mechanical properties such as high strength, high stiffness and high abrasion resistance. In particular, silicon nitride (Si₃N₄) Fine Ceramics are used as bearing balls to make high-performance bearings that are incorporated into various machines.

Advantages

• High strength
• Excellent abrasion resistance
• High stiffness
• Excellent corrosion resistance

Typical applications

FAQ

FAQ on silicon nitride Fine Ceramics

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• Properties of Si₃N₄ material(about 68KB)[a new window will open]