AlN active-metal-brazed copper (AMC)
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Outline
Toshiba Materials offers two kinds of copper-plated ceramic substrates to meet diversified requirements that have arisen in power module substrates.
Active-metal-brazed copper (AMC) substrates are made by joining copper circuit plate onto ceramic substrates by brazing. They are suitable for making fine-patterned power module circuits with high heat resistance and excellent cost performance. Aluminum nitride and alumina are available as ceramic substrates.
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Advantages
- Low thermal resistance, on account of their simple structure in which copper circuit plates are joined onto ceramic substrates
- You can mount silicon pellets directly on the substrates, because their thermal expansion coefficients are similar to that of silicon.
- High reliability, because of the high adhesion strength of the copper circuit plates to the ceramic substrates
- Capable of large currents
- Miniaturized, high-density mounting
- High thermal cycle resistance
FAQ
FAQ on Aluminum nitride fine ceramics
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